16 124 897 livres à l’intérieur 175 langues
2 047 051 livres numériques à l’intérieur 101 langues
Cela ne vous convient pas ? Aucun souci à se faire ! Vous pouvez renvoyer le produit dans les 30 jours
Impossible de faire fausse route avec un bon d’achat. Le destinataire du cadeau peut choisir ce qu'il veut parmi notre sélection.
Politique de retour sous 30 jours
The stencil printing of pastes (solder paste and§electrical conductive adhesives) is a very important§stage in the assembly of electronic packages. There§is wide agreement in industry that the paste printing§process accounts for the majority of assembly§defects, which originate from poor understanding of§the correlation between the paste rheology and the§printing process. The development of new pastes§formulations is a complex process. As a result more§extensive rheological characterisation techniques are§required to understand the flow behaviour of the§pastes under different shear conditions. This book§focuses on the rheological characterisation of pastes§and their correlation to the stencil printing§process. A general guideline has been developed from§the extensive set of results from this research, in§particular, on the aspect of correlating key paste§performance indicators to the rheological test§methods. The book is aimed at paste and electronic§manufacturers with an interest of incorporating§rheology as a research and quality assurance tool in§their formulation and production processes.