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Stress-Induced Phenomena in Metallization
Language
English
English
Book
Hardback
The conference was on reliability related science in ULSI interconnect. Its main purpose was to disc...
Full description
Libristo code: 01391065
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The conference was on reliability related science in ULSI interconnect. Its main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips. All papers were peer reviewed.
About the book
Full name
Stress-Induced Phenomena in Metallization
Author
Shinichi Ogawa, Paul S. Ho, Ehrenfried Zschech
Language
English
English
Binding
Book - Hardback
Date of issue
2007
Number of pages
204
EAN
9780735404595
ISBN
0735404593
Libristo code
01391065
Publishers
Springer, Berlin
Dimensions
162 x 234
