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Nanoparticle Engineering for Chemical-Mechanical Planarization

Language EnglishEnglish
Book Hardback
Book Nanoparticle Engineering for Chemical-Mechanical Planarization Jea-Gun Park
Libristo code: 06708211
Publishers Taylor & Francis Inc, February 2009
Explains the physicochemical properties of nanoparticles according to each step in the chemical mech... Full description
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Explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP and noble metal CMP. This work also presents design techniques using polymeric additives to improve CMP performance.

About the book

Full name Nanoparticle Engineering for Chemical-Mechanical Planarization
Author Jea-Gun Park
Language English
Binding Book - Hardback
Date of issue 2009
Number of pages 224
EAN 9781420059113
ISBN 9781420059113
Libristo code 06708211
Weight 570
Dimensions 156 x 234 x 20
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