[email protected]
LIBRISTO 0
Austrian Post 5.99 € DPD courier 6.49 € GLS courier 4.49 €
phone Contact phoneHow to shop

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Language EnglishEnglish
Book Hardback
Book Foldable Flex and Thinned Silicon Multichip Packaging Technology John W. Balde
Libristo code: 01397192
Publishers Springer, January 2003
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods use... Full description
? points 488 b
206.48 € včetně DPH
Low in stock at our supplier Shipping in 13-16 days
Austria Delivery to Austria

30-day return policy

You might also be interested in

TOP
Tea at Fortnum & Mason Fortnum & Mason Plc / Hardback
common.buy 12.41 €
TOP
Keep Going Austin Kleon / Paperback
common.buy 14.01 €
TOP
Maestro Bob Woodward / Paperback
common.buy 19.47 €
TOP
Pop Manga Mermaids and Other Sea Creatures Camilla D'Errico / Paperback
common.buy 15.30 €
Alfred's Basic Adult All-in-One Course Willard A. Palmer / Paperback
common.buy 23.54 €
Last Wish Andrzej Sapkowski / Paperback
common.buy 9.41 €
Monetizing Innovation - How Smart Companies Design the Product Around the Price Madhavan Ramanujam / Hardback
common.buy 29.21 €
5-Minute Halloween Stories Disney Storybook Art Team / Hardback
common.buy 12.41 €
The Greatest Rock Guitar Riffs Alfred Publishing Staff / Paperback
common.buy 19.15 €
Punisher: Welcome Back, Frank Garth Ennis / Paperback
common.buy 26.96 €
COMING SOON
African Twilight Carol Beckwith / Hardback
common.buy 150.81 €
Dismantling Democracy in Venezuela Allan Brewer-Carías / Paperback
common.buy 48.59 €
Elite Weapons for LEGO Fanatics Martin Hudepohl / Paperback
common.buy 28.03 €
Multiple Dirichlet Series, L-functions and Automorphic Forms Daniel Bump / Hardback
common.buy 134.22 €
Intrinsic Properties of Group IV Elements and III-V, II-VI and I-VII Compounds / Intrinsische Eigenschaften von Elementen der IV. Gruppe und von III-V O. Madelung / Hardback
common.buy 1 271.77 €
International Law Reports E. LauterpachtC. J. Greenwood / Hardback
common.buy 151.99 €

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

About the book

Full name Foldable Flex and Thinned Silicon Multichip Packaging Technology
Author John W. Balde
Language English
Binding Book - Hardback
Date of issue 2003
Number of pages 347
EAN 9780792376767
ISBN 0792376765
Libristo code 01397192
Publishers Springer
Weight 1550
Dimensions 155 x 235 x 26

Categories

Technology, Engineering, Agriculture > Mechanical engineering & materials > Production engineering
Give this book today
It's easy
1 Add to cart and choose Deliver as present at the checkout 2 We'll send you a voucher 3 The book will arrive at the recipient's address

Login

Log in to your account. Don't have a Libristo account? Create one now!

 
mandatory
mandatory
Forgotten password

Don’t have an account? Discover the benefits of having a Libristo account!

With a Libristo account, you'll have everything under control.

Create a Libristo account