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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Language EnglishEnglish
Book Paperback
Book Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® Erdogan Madenci
Libristo code: 06796145
Publishers Springer, Berlin, March 2013
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in... Full description
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Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. §Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

About the book

Full name Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Author Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
Language English
Binding Book - Paperback
Date of issue 2013
Number of pages 185
EAN 9781461349891
ISBN 1461349893
Libristo code 06796145
Publishers Springer, Berlin
Weight 326
Dimensions 155 x 235 x 11

Categories

Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
Technology, Engineering, Agriculture > Technology: general issues > Engineering: general
Technology, Engineering, Agriculture > Mechanical engineering & materials > Engineering skills & trades
Technology, Engineering, Agriculture > Energy technology & engineering > Electrical engineering
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