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Advanced Materials for Thermal Management of Electronic Packaging

Language EnglishEnglish
Book Paperback
Book Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong
Libristo code: 01427549
Publishers Springer-Verlag New York Inc., February 2013
This book offers a comprehensive approach to advanced thermal management in electronic packaging, in... Full description
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This book offers a comprehensive approach to advanced thermal management in electronic packaging, including the fundamentals of heat transfer, component design guidelines, materials selection, cooling, characterization, processing and manufacturing and more.

About the book

Full name Advanced Materials for Thermal Management of Electronic Packaging
Author Xingcun Colin Tong
Language English
Binding Book - Paperback
Date of issue 2013
Number of pages 618
EAN 9781461427926
ISBN 1461427924
Libristo code 01427549
Publishers Springer-Verlag New York Inc.
Weight 946
Dimensions 236 x 243 x 31

Categories

Technology, Engineering, Agriculture > Mechanical engineering & materials > Materials science > Engineering thermodynamics
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronics: circuits & components
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
Mathematics & Science > Physics
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